Heat Sink Thermal Compound Paste (Big)
₹22.00
inc. GST
Quantity
This high-performance thermal compound paste is designed to enhance heat transfer between electronic components and cooling solutions for improved thermal management. Supplied in a precision syringe, it allows accurate and controlled application, reducing waste and simplifying installation. The advanced formula combines excellent thermal conductivity with electrical insulation, making it suitable for a wide range of computing and electronic applications. Engineered to remain stable under demanding conditions, it resists drying, evaporation, and corrosion while maintaining reliable performance across a broad temperature range. Ideal for processors, graphics cards, chipsets, power components, and other heat-generating devices, this thermal paste helps support efficient cooling and long-term system reliability.
| Product Type | High-performance thermal compound paste |
| Application Method | Precision injection syringe |
| Thermal Characteristics | High thermal conductivity, electrical insulation, and high-temperature endurance |
| Material Properties | Non-drying, non-volatile, non-toxic, and non-corrosive |
| Operating Temperature Range | Effective from -50°C to 210°C |
| Suitable Applications | CPU, GPU, chipsets, transistors, diodes, and rectifiers |
| Dimensions | 15.24 cm x 1.27 cm x 2.54 cm(Length X Width X Height) |
